Semiconductor Chip Vision Inspection Machine

Semiconductor Chip Vision Inspection MachineThis machine is used to detect and sort surface defects of motor armature, shaft and semiconductor. 3D and 2D vision algorithms are used for accurate positioning and defect recognition. The self-developed line laser 3D camera is used to scan the product contour for defect analysis. It adopts mature image processing algorithm and visual user interface, which is convenient for users to add or modify the detection content.Features Machine vision technology for dimension measurement, surface defect detection and space attitude recognition of different parts1) Submicron surface topography measurement technology based on spectral confocal sensor2) Micro scale surface topography measurement technology based on line laser 3D sensor3) 2D image deep learning processing algorithm based on artificial intelligence neural network4) 3D point cloud data analysis algorithm based on open source point cloud Library5) Submicron diameter measurement sensor based on precision grating ruler6) Line laser 3D sensor and multi sensor data fusion algorithm  Specification   Name Parameters 1 Inspection mode 2D optical inspection, 3D line laser scanning 2 Insepction accuracy 0.001mm 3 Inspection efficiency 5s/pcs 4 Loading and unloading mode Automatic 5 Machine weight 650kg 6 Machine size 1300*950*1750mm 7 Power 220V 50HZ,1.5KW /* March 10, 2023 17:59:20 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1