Semicon Packaging Clenaing Machine

Machine Description: SC820 is a semiconductor packaging in line cleaning system. Use to clean flux and other contamination on Chips after soldering during chip packaging process. SC820 is design to clean lead frame, IGBT, IPM, BGA,CSP chips.Machine Features: 1.Semiconductor chips in line clean in packaging process.2.Spray clean to remove flux and other contamination.3.Long chemical wash+ DI water rinse+ Hot air dry process.4.Wash liquid and rinse DI water add/discharge automatically.5.Wash liquid spray pressure can adjust for different chips.6.High flow amount and high pressure liquid for precise FC packaging chips.7.DI water resistivity monitoring system.8.Air blow+ Hot air dry system.9.PLC control system, English interface and friendly operation system.10.304 stainless steel frame structure.11.SMEMA lines to connect up and down stream equipment.12.Wash liquid concentration real time monitoring system. Machine Spec: ItemSC820 SPECConveyor net width600mmConveyor net speed100~1500mm/min, suggest 300~400mm/minConveyor height900±50mmPCB conveyor directionFrom Left to RightPCB width60~500mmPCB clean height0~100mmClean tank30LRinse tank30L-120LDI water consumption0.5~1.0m³/HExhausted air40m³/HControlPLCPower/air supply380VAC,3P,50/60HZ,90KW/0.5MpaResistivity range0~18MΩMachine sizeL6600*W1750*H1650mmMachine weight3500KG  /* January 22, 2024 19:08:37 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1